Heterogeneous Three-Layer TSV Chip Stacking Assembly With Moldable Underfill-Reference-Cited by-同舟云学术

Heterogeneous Three-Layer TSV Chip Stacking Assembly With Moldable Underfill

Published:2013-11 Issue:11 Volume:3 Page:1960-1970
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Pei-Siang Sharon Lim,Che Fa Xing,Choong Chong Ser,Rong Michelle Chew Bi,Sekhar Vasarla Nagendra,Rao Vempati Srinivasa,Chong Chai Tai

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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5. Process Development of 4-Die Stack Module Using Moldable Underfill;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05