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A Dynamic Control System for Server Processor Direct Liquid Cooling

  • Published:2020-05 Issue:5 Volume:10 Page:786-794
  • ISSN:2156-3950
  • Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
  • language:
  • Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Chen HaoranORCID,Han YongORCID,Tang GongyueORCID,Zhang XiaowuORCID

Funder

National Research Foundation, Prime Minister’s Office, Singapore, through the Green Data Centre Research Programme

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhancing data center cooling efficiency and ability: A comprehensive review of direct liquid cooling technologies;Energy;2024-11

2. Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03

3. Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Cooling for High Heat Flux 3D ICs;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. Thermal Modeling and Thermal-aware Energy Saving Methods for Cloud Data Centers: A Review;IEEE Transactions on Sustainable Computing;2023

5. Development of Advanced Liquid Cooling Solution on Data Centre Cooling;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
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