Flexible Chip-First Millimeter-Wave Packaging Using Multiple Dielectrics
Author:
Affiliation:
1. Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA
Funder
Honeywell Federal Manufacturing & Technologies, LLC which manages and operates the Department of Energy’s National Security Campus
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/5503870/9765761/09737514.pdf?arnumber=9737514
Reference32 articles.
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2. Online Monitoring of Functional Electrical Properties in Aerosol Jet Printing Additive Manufacturing Process Using Shape-From-Shading Image Analysis
3. Inkwells for on-demand deposition rate measurement in aerosol-jet based 3D printing
4. Realization of Fully 3D Printed W-Band Bandpass Filters Using Aerosol Jet Printing Technology
5. Aerosol Jet 3D-Printed Compact EBG Resonators
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