A New Inductor Assembly Method for POL Power Module 3D Packaging-Reference-Cited by-同舟云学术

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A New Inductor Assembly Method for POL Power Module 3D Packaging

Published:2023-12-28 Issue: Volume: Page:389-394
ISSN:
Container-title:2023 2nd Asia Power and Electrical Technology Conference (APET)
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Author:

Wu Weimin¹,Liu Chuan¹,Zeng Jianhong²,Li Yayu²,Wu Wally³,Lin Mars³,Liu Zhengyang²

Affiliation:

1. School of Logistics Engineering, Shanghai Maritime University,Shanghai,China

2. Shanghai MetaPWR Electronics Co., Ltd.,Shanghai,China

3. Ark Semiconductor Corp. Ltd.,Taibei,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10488911/10488919/10489279.pdf?arnumber=10489279

Reference8 articles.

1. POL tile as a small package for a power module

2. Predicting the reliability of electronic equipment

3. μMODULE POWER PRODUCTS;Linear Technology, Analog Devices

4. Low profile LTCC inductor substrate for multi-MHz integrated POL converter

5. Design of a Lightweight Low Inductance Power Module with Ceramic Baseplates

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