POL tile as a small package for a power module

Author:

Murayama Kei1,Kaneko Amane1,Aizawa Mitsuhiro1,Hayashibe Shingo1,Oi Kiyoshi1

Affiliation:

1. Shinko Electric Industries Co., Ltd,R & D Div.,Process Development Dept,Nagano,Japan

Publisher

IEEE

Reference7 articles.

1. Evaluation of Encapsulation Resin Structure for POL Tile;murayama;Proceedings of PCIM Europe 2021,2021

2. Study of POL tile using Ag sintering material;murayama;Proceedings of PCIM Europe 2020,2020

3. Evaluation of Ag-sinter and CuSn-Tlp based joining technologies on lead frame;otto;Proceedings of PCIM Europe 2018,2018

4. Temperature Cycling;JEDEC Standards Report JESD22-A104-B,2000

5. Thermal Characteristic Evaluation of Silver and Copper Sintering Materials

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A New Inductor Assembly Method for POL Power Module 3D Packaging;2023 2nd Asia Power and Electrical Technology Conference (APET);2023-12-28

2. Thermal stress reliability comparison of WB and POL-kW structure by Power cycling and simulation;2023 IEEE Applied Power Electronics Conference and Exposition (APEC);2023-03-19

3. Study on thermal stress behavior of mold type POL tile;2023 IEEE Applied Power Electronics Conference and Exposition (APEC);2023-03-19

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