Susceptibility Analysis of LEON3 Embedded Processor against Multiple Event Transients and Upsets

Author:

Abbasitabar Hamed,Zarandi Hamid R.,Salamat Ronak

Publisher

IEEE

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Layout-based reliability analysis of openMSP430 register file under external radiations;2023 International Conference on Microelectronics (ICM);2023-12-17

2. Soft Error Assessment Methodology;Synthesis Lectures on Engineering, Science, and Technology;2023

3. Related Works;Synthesis Lectures on Engineering, Science, and Technology;2023

4. Layout-based Vulnerability Analysis of LEON3 Processor to Single Event Multiple Transients using Satisfiability Modulo Theories;2022 23rd International Symposium on Quality Electronic Design (ISQED);2022-04-06

5. Evaluation of the soft error assessment consistency of a JIT‐based virtual platform simulator;IET Computers & Digital Techniques;2021-02-23

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