Affiliation:
1. Department of Electrical Engineering and Computer Science, DGIST, Daegu, South Korea
Funder
Samsung Electronics Co., Ltd
National Research Foundation of Korea
Institute of Information and communications Technology Planning and Evaluation
Korea government
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Hardware and Architecture
Reference13 articles.
1. The gap benchmark suite;beamer,2015
2. SPEC CPU2006 benchmark descriptions
3. 3D-Xpath
4. TMO: transparent memory offloading in datacenters
5. Gen-Z: Communication at the speed of memory;krause;IEEE Supercomputing,2017
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