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Hierarchical Simulation of Process Variations and Their Impact on Circuits and Systems: Methodology

  • Published:2011-08 Issue:8 Volume:58 Page:2218-2226
  • ISSN:0018-9383
  • Container-title:IEEE Transactions on Electron Devices
  • language:
  • Short-container-title:IEEE Trans. Electron Devices

Author:

Lorenz Jürgen K.1,Bar Eberhard1,Clees Tanja2,Jancke Roland3,Salzig Christian P. J.4,Selberherr Siegfried5

Affiliation:

1. Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Erlangen , Germany

2. Fraunhofer Institute for Algorithms and Scientific Computing (SCAI), Sankt Augustin , Germany

3. Division Design Automation of the Fraunhofer Institute for Integrated Circuits (IIS/EAS), Dresden, Germany

4. Fraunhofer Institute for Industrial Mathematics (ITWM), Kaiserslautern, Germany

5. Institute for Microelectronics of the Technical University Vienna, Vienna, Austria

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An Optimization Framework for GaN Power Device Design and Applications;2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA);2019-10

2. Process variation-aware gate sizing with fuzzy geometric programming;Computers & Electrical Engineering;2019-09

3. Process Variability—Technological Challenge and Design Issue for Nanoscale Devices;Micromachines;2018-12-23

4. Process Variability for Devices at and beyond the 7 nm Node;ECS Journal of Solid State Science and Technology;2018

5. Parameter Studies for Energy Networks with Examples from Gas Transport;Simulation-Driven Modeling and Optimization;2016
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