Investigation on Cu TSV-Induced KOZ in Silicon Chips: Simulations and Experiments-Reference-Cited by-同舟云学术

Investigation on Cu TSV-Induced KOZ in Silicon Chips: Simulations and Experiments

Published:2013-07 Issue:7 Volume:60 Page:2331-2337
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Tsai Ming-Yi,Huang Pu-Shan,Huang Chen-Yu,Jao Hsiu,Huang Brady,Wu Blacksmith,Lin Yuan-Yuan,Liao Will,Huang Joe,Huang Lawrence,Shih Steven,Lin Jeng Ping

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/16/6542005/06527893.pdf?arnumber=6527893

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