Real-time thermal monitoring of power semiconductors in power electronics using linear parameter-varying models for variable coolant flow situations-Reference-Cited by-同舟云学术

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Real-time thermal monitoring of power semiconductors in power electronics using linear parameter-varying models for variable coolant flow situations

Published:2014-06 Issue: Volume: Page:
ISSN:
Container-title:2014 IEEE 15th Workshop on Control and Modeling for Power Electronics (COMPEL)
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Author:

Warwel Manuel,Wittler Gerd,Hirsch Michele,Reuss Hans-Christian

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6870561/6877101/06877142.pdf?arnumber=6877142

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. PINN-based Dynamical Modeling and State Estimation in Power Inverters;2024 IEEE Conference on Control Technology and Applications (CCTA);2024-08-21

2. Review on the Thermal Parameters Applications in the Reliability of Power Semiconductor Device;2024 IEEE 7th International Electrical and Energy Conference (CIEEC);2024-05-10

3. Active Thermal Control of IGBT Modules Based on Finite-Time Boundedness;Micromachines;2023-11-08

4. Overtemperature Protection of Power Electronic Modules with Reduced Driveline Oscillations in Electric Vehicles;2023 IEEE Energy Conversion Congress and Exposition (ECCE);2023-10-29

5. Online Learning and Adaptation of Nonlinear Thermal Networks for Power Inverters;IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society;2023-10-16

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