Author:
Aleksov A.,Dogiamis G.,Kamgaing T.,Elsherbini A.,Swan J.,Darmawikarta K.,Boyapati S.,Holloway J.,Han R.
Cited by
2 articles.
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1. Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-02
2. Multi-layer FCCSP organic packaging for D-band millimeter wave applications;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05