Spice-Compatible Modeling of Double Barrier MTJ for Highly Reliable Circuits-Reference-Cited by-同舟云学术

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Spice-Compatible Modeling of Double Barrier MTJ for Highly Reliable Circuits

Published:2023-10-27 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)
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Author:

Wang You¹,Xu Yefan¹,Zhang Chaoyue¹,Gong Yu¹,Cai Hao²,Liu Weiqiang¹

Affiliation:

1. College of Electronic Information and Engineering, Nanjing University of Aeronautics and Astronautics,Key Laboratory of Aerospace Integrated Circuits and Microsystem,Nanjing,China,211106

2. School of Integrated Circuits, Southeast University,Nanjing,China,210096

Funder

Natural Science Foundation of Jiangsu Province

Fundamental Research Funds for the Central Universities

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10363774/10363775/10364331.pdf?arnumber=10364331

Reference5 articles.

1. Memory leads the way to better computing

2. Compact Model of Dielectric Breakdown in Spin-Transfer Torque Magnetic Tunnel Junction

3. Current-induced magnetization switching in atom-thick tungsten engineered perpendicular magnetic tunnel junctions with large tunnel magnetoresistance

4. Robust Ultra-Low Power Non-Volatile Logic-in-Memory Circuits in FD-SOI Technology

5. A Compact Model with Spin-Polarization Asymmetry for Nanoscaled Perpendicular MTJs

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