Two-Phase Immersion Cooling of Microprocessors with Electroplated Porous Heat Spreaders: Thermal Performance and Reliability-Reference-Cited by-同舟云学术

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Two-Phase Immersion Cooling of Microprocessors with Electroplated Porous Heat Spreaders: Thermal Performance and Reliability

Published:2021-06-01 Issue: Volume: Page:
ISSN:
Container-title:2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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Author:

Sayed Chady Al,Ghaffari Omidreza,Larimi Yaser Nabavi,Grenier Francis,Jasmin Simon,Frechette Luc,Sylvestre Julien

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9502930/9503122/09503279.pdf?arnumber=9503279

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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4. Experimental investigation of the thermal resistance of advanced two-phase thermosyphon heatsinks;Applied Thermal Engineering;2024-02

5. Boiling-induced thermal degradation of copper inverse opals and its mitigation;International Communications in Heat and Mass Transfer;2024-02

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