A 10TFLOPS Datacenter-Oriented GPU with 4-Corner Stacked 64GB Memory by The Means of 2.5D Packaging Technology-Reference-Cited by-同舟云学术

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A 10TFLOPS Datacenter-Oriented GPU with 4-Corner Stacked 64GB Memory by The Means of 2.5D Packaging Technology

Published:2023-11-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE Asian Solid-State Circuits Conference (A-SSCC)
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Author:

Wang Shuang¹,Chen Weiliang¹,Li Xueqing¹,Liu Leibo¹,Yang Huazhong¹

Affiliation:

1. Tsinqhua University,Beijing,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10347557/10347908/10347909.pdf?arnumber=10347909

Reference7 articles.

1. GPU Computing

2. The A100 Datacenter GPU and Ampere Architecture;Jack;ISSCC,2021

3. 8.4 Radeon RX 5700 Series: The AMD 7nm Energy-Efficient High-Performance GPUs

4. Wafer Level System Integration of the Fifth Generation CoWoS®-S with High Performance Si Interposer at 2500 mm2

5. Understanding Chiplets Today to Anticipate Future Integration Opportunities and Limits

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