Funder
General Research Fund from the Research Grant Council of Hong Kong
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
6 articles.
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1. Enhanced Reliability of Ultra-low-k Dielectric with Columnar Pores Using hBN Capping Layer;2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA);2024-04-22
2. Hollow Airgap Technology for CMOS Maximum Interconnect Capacitance Reduction;2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT);2022-10-25
3. Mechanically Stable Ultra-Low-K Dielectric and Air-Gap Technology;2020 China Semiconductor Technology International Conference (CSTIC);2020-06-26
4. Ultralow-${k}$ Dielectric With Structured Pores for Interconnect Delay Reduction;IEEE Transactions on Electron Devices;2020-05
5. Parylene C as a multifunctional insulator for all-organic flexible electronics;Behavior and Mechanics of Multifunctional Materials XIII;2019-03-29