A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application
Author:
Affiliation:
1. School of Automation and Information Engineering, Xi’an University of Technique, Xi’an, China
2. School of Microelectronics, Xidian University, Xi’an, China
Funder
Fok Ying Tung Education Foundation
Shaanxi Innovation Capacity Support Project
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Link
http://xplorestaging.ieee.org/ielx7/92/9809833/09761138.pdf?arnumber=9761138
Reference32 articles.
1. Guided-wave and leakage characteristics of substrate integrated waveguide;xu;IEEE Trans Microw Theory Techn,2005
2. Microstrip Filters for RF/Microwave Applications
3. Compact tri-band notched UWB bandpass filter based on interdigital hairpin finger structure
4. An Ultracompact Butterworth Low-Pass Filter Based on Coaxial Through-Silicon Vias
5. Ultra-Compact TSV-Based L-C Low-Pass Filter With Stopband Up to 40 GHz for Microwave Application
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2. A compact fifth-order SIW BPF based on TSV technology with high selectivity;Microelectronics Journal;2024-02
3. An Ultra-Miniature W-Band Bandpass Filter With Ultra-Stopband Based on 3-D TSV Technology;2023 Asia-Pacific Microwave Conference (APMC);2023-12-05
4. A Miniaturized Wideband SIR Interdigital Bandpass Filter With High Performance Based on TSV Technology for W-Band Application;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-06
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