Compact Quad-band Filter with Bridged-T Coil Based on Through-Silicon Vias Technology
Author:
Affiliation:
1. Xidian University,School of Microelectronics,Xi’an,China,710000
Funder
National Natural Science Foundation of China
Research and Development
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10210847/10211258/10211959.pdf?arnumber=10211959
Reference17 articles.
1. An Ultracompact Butterworth Low-Pass Filter Based on Vertical Spiral TSV Inductor
2. Design of Compact Multi-Layered Quad-Band Bandpass Filter
3. An ultracompact butterworth low-pass filter based on coaxial through-silicon vias [J];j;IEEE Transactions on Very Large Scale Integration (VLSI) Systems,2017
4. Miniaturized SIW Bandpass Filter Based on TSV Technology for THz Applications
5. Miniature Butler Matrix Design Using Glass-Based Thin-Film Integrated Passive Device Technology for 2.5-GHz Applications
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