BMC-Based Temperature-Aware SBST for Worst-Case Delay Fault Testing Under High Temperature-Reference-Cited by-同舟云学术

BMC-Based Temperature-Aware SBST for Worst-Case Delay Fault Testing Under High Temperature

Published:2022-11 Issue:11 Volume:30 Page:1677-1690
ISSN:1063-8210
Container-title:IEEE Transactions on Very Large Scale Integration (VLSI) Systems
language:
Short-container-title:IEEE Trans. VLSI Syst.

Author:

Zhang Ying¹^ORCID,Ding Yi¹,Peng Zebo²^ORCID,Li Huawei³^ORCID,Fujita Masahiro⁴^ORCID,Jiang Jianhui¹^ORCID

Affiliation:

1. School of Software Engineering, Tongji University, Shanghai, China

2. Embedded Systems Laboratory, Linkoping University, Linkoping, Sweden

3. SKLCA, Institute of Computing Technology, Chinese Academy of Sciences, Beijing, China

4. VLSI Design and Education Center, The University of Tokyo, Tokyo, Japan

Funder

National Key Research and Development Program of China

National Natural Science Foundation of China

Zhejiang Laboratory

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

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