A Modular Shared L2 Memory Design for 3-D Integration-Reference-Cited by-同舟云学术

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A Modular Shared L2 Memory Design for 3-D Integration

Published:2015-08 Issue:8 Volume:23 Page:1485-1498
ISSN:1063-8210
Container-title:IEEE Transactions on Very Large Scale Integration (VLSI) Systems
language:
Short-container-title:IEEE Trans. VLSI Syst.

Author:

Azarkhish Erfan^ORCID,Rossi Davide,Loi Igor,Benini Luca

Funder

European Union (EU) through the FP7 Programme, European Research Council, within the Multitherman Project

YINS Project, financed with a grant from the Swiss Nano-Tera.ch initiative, and evaluated by the Swiss National Science Foundation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx7/92/7164363/06876020.pdf?arnumber=6876020

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Future of the Non-memory Semiconductor Industry;Handbook of Emerging Materials for Semiconductor Industry;2024

2. A survey of optimization techniques for thermal-aware 3D processors;Journal of Systems Architecture;2019-08

3. Neurostream: Scalable and Energy Efficient Deep Learning with Smart Memory Cubes;IEEE Transactions on Parallel and Distributed Systems;2018-02-01

4. Logic-Base Interconnect Design for Near Memory Computing in the Smart Memory Cube;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2017-01

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