Scan Test of Die Logic in 3-D ICs Using TSV Probing-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Scan Test of Die Logic in 3-D ICs Using TSV Probing

Published:2015-02 Issue:2 Volume:23 Page:317-330
ISSN:1063-8210
Container-title:IEEE Transactions on Very Large Scale Integration (VLSI) Systems
language:
Short-container-title:IEEE Trans. VLSI Syst.

Author:

Noia Brandon,Panth Shreepad,Chakrabarty Krishnendu,Sung Kyu Lim

Funder

National Science Foundation

Semiconductor Research Corporation (SRC)

Graduate Fellowship through the SRC

SRC through the Integrated Circuit and Systems Sciences Program

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx7/92/7027264/06767146.pdf?arnumber=6767146

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Short Review of Through-Silicon via (TSV) Interconnects: Metrology and Analysis;Applied Sciences;2023-07-18

2. Low-Power Technique for Yield-Enhanced 3D Interconnects;3D Interconnect Architectures for Heterogeneous Technologies;2022

3. A Novel TDMA-Based Fault Tolerance Technique for the TSVs in 3D-ICs Using Honeycomb Topology;IEEE Transactions on Emerging Topics in Computing;2021-04-01

4. TSV fault contactless testing method based on group delay;International Journal of Electronics;2021-02-16

5. Test Time Reduction of 3-D Stacked ICs Using Ternary Coded Simultaneous Bidirectional Signaling in Parallel Test Ports;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2020-12

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP