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Parallel Thermal Analysis of 3-D Integrated Circuits With Liquid Cooling on CPU-GPU Platforms

  • Published:2015-03 Issue:3 Volume:23 Page:575-579
  • ISSN:1063-8210
  • Container-title:IEEE Transactions on Very Large Scale Integration (VLSI) Systems
  • language:
  • Short-container-title:IEEE Trans. VLSI Syst.

Author:

Xue-Xin Liu ,Kuangya Zhai ,Zao Liu ,Kai He ,Tan Sheldon X.-D,Wenjian Yu

Funder

NSF

Semiconductor Research Corporation

NSFC

Tsinghua University Initiative Scientific Research Program

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. LB-ADI: An Efficient Method for Transient Thermal Simulation of Integrated Chiplets and Packages;IEEE Journal on Multiscale and Multiphysics Computational Techniques;2024

2. Efficient Thermal Analysis of Integrated Circuits and Packages With Microchannel Cooling Using Laguerre-Based Layered Finite Element Method;IEEE Journal on Multiscale and Multiphysics Computational Techniques;2023

3. An Efficient ADI Method for Transient Thermal Simulation of Liquid-Cooled 3-D ICs;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-09

4. A New AINV Preconditioner for the CG Method in Hybrid CPU-GPU Computing Environment;Journal of Information Processing;2022

5. PACT: An Extensible Parallel Thermal Simulator for Emerging Integration and Cooling Technologies;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2021
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