General Parameterized Thermal Modeling for High-Performance Microprocessor Design-Reference-Cited by-同舟云学术

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General Parameterized Thermal Modeling for High-Performance Microprocessor Design

Published:2012-02 Issue:2 Volume:20 Page:211-224
ISSN:1063-8210
Container-title:IEEE Transactions on Very Large Scale Integration (VLSI) Systems
language:
Short-container-title:IEEE Trans. VLSI Syst.

Author:

Eguia Thom J.,Tan Sheldon X.-D.,Shen Ruijing,Li Duo,Pacheco Eduardo H.,Tirumala Murli,Wang Lingli

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx5/92/6129939/05696798.pdf?arnumber=5696798

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. Effectiveness of neural networks and transfer learning for indoor air-temperature forecasting;Automation in Construction;2022-08

4. Compact Thermal Sensors for Dense CPU Thermal Monitoring and Regulation: A Review;IEEE Sensors Journal;2021-06-01

5. Post-Silicon Heat-Source Identification and Machine-Learning-Based Thermal Modeling Using Infrared Thermal Imaging;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2021-04

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