An Ultrahigh Vacuum Packaging Process Demonstrating Over 2 Million Q-Factor in MEMS Vibratory Gyroscopes-Reference-Cited by-同舟云学术

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An Ultrahigh Vacuum Packaging Process Demonstrating Over 2 Million Q-Factor in MEMS Vibratory Gyroscopes

Published:2017-12 Issue:6 Volume:1 Page:1-4
ISSN:2475-1472
Container-title:IEEE Sensors Letters
language:
Short-container-title:IEEE Sens. Lett.

Author:

Asadian Mohammad H.^ORCID,Askari Sina,Shkel Andrei M.^ORCID

Funder

DARPA

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Instrumentation

Link

http://xplorestaging.ieee.org/ielx7/7782634/8069040/08064729.pdf?arnumber=8064729

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2. Silicon-based membrane pressure sensor for inline monitoring of pressure and hermeticity of small-volume bonded packages;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Mode-Matched Disk Resonator Gyroscope in (100) Single Crystal Silicon with Shock Resistance;2024 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL);2024-03-25

4. In-sensor human gait analysis with machine learning in a wearable microfabricated accelerometer;Communications Engineering;2024-03-16

5. A Mechanically Amplified Quad Mass Gyroscope with Parameteric Σ-Δ Modulation for Offset Drift Cancellation;2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS);2024-01-21

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