Author:
Tz-Cheng Chiu ,Che-Li Gung ,Hong-Wei Huang ,Yi-Shao Lai
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials
Cited by
17 articles.
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1. How to Manipulate Warpage in Fan-out Wafer and Panel Level Packaging;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Warpage Estimation of Panel-Level Packaging by AI-assisted Design on Simulation;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
3. Studying Asymmetric Warpage Behavior of Panel-Level Packages Using Process Modeling Techniques and Viscoelasticity Theory;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
4. Manufacturing for Reliability of Panel-Level Fan-out Packages;Reliability of Organic Compounds in Microelectronics and Optoelectronics;2022
5. Package Warpage Modeling by Considering Shrinkage Behavior of EMC and Substrate;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07