Physics-Based SPICE Modeling of Dynamic on-State Resistance of p-GaN HEMTs
Author:
Affiliation:
1. National ASIC System Engineer Research Center, Southeast University, Nanjing, China
2. National Center of Technology Innovation for EDA, Southeast University, Nanjing, China
3. Julin Tech. Co. Ltd., Shanghai, China
Funder
National Natural Science Foundation of China
China Postdoctoral Science Foundation
Key Research Program of Jiangsu Province
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/63/10130046/10086699.pdf?arnumber=10086699
Reference21 articles.
1. A GaN-HEMT Compact Model Including Dynamic RDSon Effect for Power Electronics Converters
2. Modelling and quantification of power losses due to dynamic on-state resistance of GaN E-mode HEMT
3. Design of a Fast Dynamic On-Resistance Measurement Circuit for GaN Power HEMTs
4. Characterisation and Modeling of Gallium Nitride Power Semiconductor Devices Dynamic On-State Resistance
5. Effects of Deep Trapping States at High Temperatures on Transient Performance of AlGaN/GaN Heterostructure Field-Effect Transistors
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1. SPICE Modelling-Assisted evaluation of dynamic on-resistance characterization in Schottky p-GaN HEMTs amid synchronous buck transient instabilities;Computers and Electrical Engineering;2024-08
2. Device Model and Energy Loss Mechanism of Enhancement-Mode p-GaN HEMTs Under Unclamped-Inductive-Switching Stress;IEEE Transactions on Electron Devices;2024-07
3. Aging Reliability Compact Modeling of Trap Effects in Power GaN HEMTs;IEEE Transactions on Device and Materials Reliability;2024-06
4. Reverse Blocking Enhancement‐Mode AlGaN/GaN HEMTs with Hybrid p‐GaN Ohmic Drain on the Si Substrates;physica status solidi (a);2023-12-03
5. Small-Signal Modeling of GaN-on-Diamond HEMT Using ANFIS Method;2023 International Symposium on Networks, Computers and Communications (ISNCC);2023-10-23
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