Real-Time Acoustic Emission Monitoring of Wear-Out Failure in SiC Power Electronic Devices During Power Cycling Tests-Reference-Cited by-同舟云学术

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Real-Time Acoustic Emission Monitoring of Wear-Out Failure in SiC Power Electronic Devices During Power Cycling Tests

Published:2021-04 Issue:4 Volume:36 Page:4420-4428
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Choe Chanyang^ORCID,Chen Chuantong^ORCID,Nagao Shijo^ORCID,Suganuma Katsuaki^ORCID

Funder

Advanced Low Carbon Technology Research and Development Program

Development of a High Frequency GaN Power Module Package Technology

New Energy and Industrial Technology Development Organization

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/63/9277726/09200556.pdf?arnumber=9200556

Cited by 25 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Development of SiC Power Module Structure by Micron-Sized Ag-Paste Sinter Joining on Both Die and Heatsink to Low-Thermal-Resistance and Superior Power Cycling Reliability;IEEE Transactions on Power Electronics;2024-09

2. Analysis of Stress Wave Characteristics in SiC MOSFETs with Solder Layer Voids;2024 3rd International Conference on Energy, Power and Electrical Technology (ICEPET);2024-05-17

3. Analysis of the Influence of Temperature on Stress Waves of Cascode GaN HEMT;IEEE Sensors Journal;2024-04-15

4. Mapping Acoustic Frictional Properties of Self-Lubricating Epoxy-Coated Bearing Steel with Acoustic Emissions during Friction Test;Technologies;2024-02-24

5. A RES-GANomaly Method for Machine Sound Anomaly Detection;IEEE Access;2024

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