Characterization of a low-loss and wide-band (DC to 170 GHz) flip-chip interconnect on an organic substrate-Reference-Cited by-同舟云学术

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Characterization of a low-loss and wide-band (DC to 170 GHz) flip-chip interconnect on an organic substrate

Published:2014-06 Issue: Volume: Page:
ISSN:
Container-title:2014 IEEE MTT-S International Microwave Symposium (IMS2014)
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Author:

Khan Wasif Tanveer,Ulusoy A. Cagri,Schmid Robert L.,Papapolymerou John

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6842514/6847849/06848343.pdf?arnumber=6848343

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Foil Flip-Chip Interconnect With an Ultra-Broadband Bandwidth of 130 GHz and Beyond for Heterogeneous High-End System Designs;IEEE Journal of Microwaves;2024-07

2. A 2-Tier TRL Calibration Technique to Assess Flip-Chip Interconnects at D-Band;2024 103rd ARFTG Microwave Measurement Conference (ARFTG);2024-06-21

3. Demonstrating Broadside-Coupled Coplanar Waveguide Interconnects to 325 GHz;IEEE Microwave and Wireless Technology Letters;2024

4. Microwave, Millimeter Wave and Terahertz Applications of Liquid Crystal;Modern Antenna;2024

5. D-Band Flip-Chip Packaging with Wafer-Level Cu-pillar Bumps;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15

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