Author:
Shi Jiajun,Li Mingyu,Moritz Csaba Andras
Cited by
4 articles.
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1. Design Space Exploration for Power Delivery Network in Next Generation 3D Heterogeneous Integration Architectures;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. SkyBridge 2.0: A Fine-grained Vertical 3D-IC Technology for Future ICs;ACM Journal on Emerging Technologies in Computing Systems;2023-10-11
3. Power Delivery Solutions and PPA Impacts in Micro-Bump and Hybrid-Bonding 3D ICs;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-12
4. Introduction to 3D Technologies;3D Interconnect Architectures for Heterogeneous Technologies;2022