1.1 Innovation For the Next Decade of Compute Efficiency
Author:
Affiliation:
1. AMD,Austin,TX
2. AMD,Fort Collins,CO
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10067248/10067251/10067810.pdf?arnumber=10067810
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1. A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)
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4. Tackling the test challenges of the chiplet revolution;rearick;ITC,2021
5. 2.2 AMD Chiplet Architecture for High-Performance Server and Desktop Products
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