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Bias-Compensated Least Squares Identification of Distributed Thermal Models for Many-Core Systems-on-Chip

  • Published:2014-09 Issue:9 Volume:61 Page:2663-2676
  • ISSN:1549-8328
  • Container-title:IEEE Transactions on Circuits and Systems I: Regular Papers
  • language:
  • Short-container-title:IEEE Trans. Circuits Syst. I

Author:

Diversi Roberto,Tilli Andrea,Bartolini Andrea,Beneventi Francesco,Benini Luca

Funder

EU FP7 ERC Project MULTITHERMAN

EU FP7 Project Phidias

Intel Labs. Braunschweig

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Cited by 17 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Modeling and Controlling Many-Core HPC Processors: an Alternative to PID and Moving Average Algorithms;ACM Transactions on Autonomous and Adaptive Systems;2024-09-09

2. Filtering-Based Bias-Compensation Recursive Estimation Algorithm for an Output Error Model with Colored Noise;Circuits, Systems, and Signal Processing;2024-05-31

3. Modeling the Thermal and Power Control Subsystem in HPC Processors;2022 IEEE Conference on Control Technology and Applications (CCTA);2022-08-23

4. Post-Silicon Heat-Source Identification and Machine-Learning-Based Thermal Modeling Using Infrared Thermal Imaging;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2021-04

5. Recursive identification of errors-in-variables models with correlated output noise;IFAC PAPERSONLINE;2021
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