Low cost flip chip technology for organic substrates-Reference-Cited by-同舟云学术

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Low cost flip chip technology for organic substrates

Published: Issue: Volume: Page:
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Container-title:1997 Proceedings 47th Electronic Components and Technology Conference
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Author:

Baba S.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx3/4801/13278/00606180.pdf?arnumber=606180

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ferrite-Based NFC Antenna and Sensor Package Module Development for Implantable Continuous Glucose Monitor;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Direct flip-chip bonding of bare dies to polypropylene-coated paper substrates without adhesives or solders;Journal of Materials Science: Materials in Electronics;2022-07-26

3. The effect of intermetallic compound evolution on the fracture behavior of Au stud bumps joined with Sn-3.5Ag solder;Electronic Materials Letters;2013-01

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