Improved thermal conductivity in microelectronic encapsulants
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx2/543/4250/00163976.pdf?arnumber=163976
Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Application of porous materials and structures for improving optical and thermal performance of inorganic and organic light-emitting diodes: A review;Sensors and Actuators A: Physical;2022-11
2. The Effects of Filler Shape, Type, and Size on the Properties of Encapsulation Molding Components;Electronics;2021-01-06
3. Impact of aluminum oxide nanopowder on thermal, optical and surface properties of polysiloxane-aluminum oxide composites as elastomeric thermal pad for light emitting diode application;Polymer-Plastics Technology and Materials;2020-02-03
4. Improvement of thermal conductivity and dielectric constant of graphene-filled epoxy nanocomposites using colloidal polymerization approach;Polymer Bulletin;2019-06-26
5. Polysiloxane-graphite composites as thermal interface material for light emitting diode application: a study on impact of graphite nanopowder on thermal and surface properties;Polymer-Plastics Technology and Materials;2019-06-18
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