Improvement of thermal conductivity and dielectric constant of graphene-filled epoxy nanocomposites using colloidal polymerization approach
Author:
Funder
FRGS
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Polymers and Plastics,Condensed Matter Physics,General Chemistry
Link
http://link.springer.com/content/pdf/10.1007/s00289-019-02853-5.pdf
Reference65 articles.
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2. Barth M, Kulkarni R, Eberhardt W, Meibner T, Soltani M, Zimmermann A (2016) Heat dissipation for MID applications in lighting technology. In: Molded interconnect devices (MID), 2016 12th international congress: IEEE, pp 1–4
3. Shtein M, Nadiv R, Buzaglo M, Regev O (2015) Graphene-based hybrid composites for efficient thermal management of electronic devices. ACS Appl Mater Interfaces 7(42):23725–23730
4. Yung KC, Liem H, Choy HS (2013) Prerequisite for maximizing thermal conductivity of epoxy laminate using filler. J Mater Sci Mater Electron 24(4):1095–1104
5. Cho S, Lee JY (2010) Heat dissipation of printed circuit board by the high thermal conductivity of photo-imageable solder resist. Electron Mater Lett 6(4):167–172
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