Effects of moisture and delamination on cracking of plastic IC packages during solder reflow-Reference-Cited by-同舟云学术

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Effects of moisture and delamination on cracking of plastic IC packages during solder reflow

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Container-title:1996 Proceedings 46th Electronic Components and Technology Conference
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Author:

Tay A.A.O.,Lin T.Y.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx3/3763/10995/00550496.pdf?arnumber=550496

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Evaluation of Vapor Pressure Induced Debonding Failure in Fan-Out Package Under Reflow Condition;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Resolving the Adhesive Behavior of 1D Materials: A Review of Experimental Approaches;Engineering;2023-05

3. A New Modified Crack Surface Displacement Extrapolation Method for Analysis of Package Delamination;Advances in Electronic Packaging, Parts A, B, and C;2005-01-01

4. Modeling of Interfacial Delamination in Plastic IC Packages Under Hygrothermal Loading;Journal of Electronic Packaging;2004-07-28

5. Fracture analysis of electronic ic package in reflow soldering process;KSME International Journal;2004-03

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