Author:
Kelly G.,Lyden C.,O'Mathuna C.,Slattery O.,Hayes T.,Exposito J.
Cited by
3 articles.
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1. The Correlation of Modelling with Measurements and Failure Modes;The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages;1999
2. Thermomechanical Stress in a PQFP;The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages;1999
3. Microsystem packaging: lessons from conventional low cost IC packaging;Journal of Micromechanics and Microengineering;1997-09-01