Tin Whisker Test Method Development-Reference-Cited by-同舟云学术

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Tin Whisker Test Method Development

Published:2006-10 Issue:4 Volume:29 Page:231-238
ISSN:1521-334X
Container-title:IEEE Transactions on Electronics Packaging Manufacturing
language:
Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Schroeder V.,Bush P.,Williams M.,Nhat Vo ,Reynolds H.L.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://xplorestaging.ieee.org/ielx5/6104/4052443/04052455.pdf?arnumber=4052455

Cited by 22 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Study of Whisker Growth from SAC0307-SiC Composite Solder Alloy;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10

2. Tin Whisker Susceptibility of SAC0307-ZnO Composite Solder Joints;2022 45th International Spring Seminar on Electronics Technology (ISSE);2022-05-11

3. Recent Advances in Mitigation of Whiskers from Electroplated Tin;JOM;2019-12-06

4. The Effects of Oxidation Layer, Temperature, and Stress on Tin Whisker Growth: A Short Review;IOP Conference Series: Materials Science and Engineering;2018-03-19

5. Corrosion-induced tin whisker growth in electronic devices: a review;Soldering & Surface Mount Technology;2017-02-06

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