Study of Whisker Growth from SAC0307-SiC Composite Solder Alloy-Reference-Cited by-同舟云学术

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Study of Whisker Growth from SAC0307-SiC Composite Solder Alloy

Published:2023-05-10 Issue: Volume: Page:
ISSN:
Container-title:2023 46th International Spring Seminar on Electronics Technology (ISSE)
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Author:

Choi Halim¹,Skwarek Agata²,Hurtony Tamás¹,Byun Jaeduk³,Illés Balázs¹

Affiliation:

1. Budapest University of Technology and Economics,Faculty of Electrical Engineering and Computer Science,Department of Electronics Technology,Budapest,Hungary

2. Łukasiewicz Research Network—Institute of Microelectronics and Photonics,Department of Microelectronics,Kraków,Poland

3. Dankook University,College of Science & Technology,Department of Physics,Cheonan,Republic of Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10168303/10168312/10168371.pdf?arnumber=10168371

Reference21 articles.

1. Grain Boundary Diffusion Sources and Their Coating Methods for Nd-Fe-B Permanent Magnets;he;Materials,2021

2. Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints

3. On certain integrals of Lipschitz-Hankel type involving products of bessel functions

4. Grain Refinement for Improved Lead-Free Solder Joint Reliability;sweatman;ICP APEX EXPO conference Proceeding,2013

5. Electron spectroscopy studies on magneto-optical media and plastic substrate interface;yorozu;IEEE Transl J Magn Japan,1987

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