Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints-Reference-Cited by-同舟云学术

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Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints

Published:2023-01 Issue: Volume:22 Page:403-412
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Skwarek Agata^ORCID,Illés Balázs,Górecki Paweł,Pietruszka Adrian^ORCID,Tarasiuk Jacek,Hurtony Tamás

Funder

Budapest University of Technology and Economics

National Research, Development and Innovation Office

Gdynia Maritime University

Ministerstwo Edukacji i Nauki

Nemzeti Kutatási Fejlesztési és Innovációs Hivatal

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference44 articles.

1. Tensile deformation behavior and melting property of nano-sized ZnO particles reinforced Sn–3.0 Ag–0.5 Cu lead-free solder;El-Daly;Mater Sci Eng, A,2014

2. Thermal analysis and mechanical properties of Sn–1.0 Ag–0.5 Cu solder alloy after modification with SiC nano-sized particles;El-Daly;J Mater Sci Mater Electron,2013

3. Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates;Salleh;J Mater Process Technol,2017

4. SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly;Ani;Solder Surf Mt Technol,2018

5. Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads;Gain;Microelectron Reliab,2011

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate;Soldering & Surface Mount Technology;2024-08-13

2. Effects of TiC nanoparticle addition on microstructures and mechanical properties of Sn-58Bi solder joints;Materials Today Communications;2024-08

3. Sn99Ag0.3Cu0.7–TiO₂ composite solder joints and their influence on thermal parameters of power components;Soldering & Surface Mount Technology;2024-07-09

4. Influence of the soldering process quality on thermal resistance of RF transistors;2024 25th International Microwave and Radar Conference (MIKON);2024-07-01

5. Influence of Parasitic Capacitances and Inductances in a Power Electronic Converter on Junction Temperature of Power GaN HEMTs;2024 31st International Conference on Mixed Design of Integrated Circuits and System (MIXDES);2024-06-27

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