Processing and reliability of CSPs with underfill-Reference-Cited by-同舟云学术

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Processing and reliability of CSPs with underfill

Published:2003-10 Issue:4 Volume:26 Page:313-319
ISSN:1521-334X
Container-title:IEEE Transactions on Electronics Packaging Manufacturing
language:en
Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Liu J.,Johnson R.W.,Yaeger E.,Konarski M.,Crane L.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://xplorestaging.ieee.org/ielx5/6104/28223/01262385.pdf?arnumber=1262385

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High-Reliability Solder Pastes For Automotive Applications Reinforcement;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25

2. Strategies for avoiding delamination in system-in-packaging devices;Microelectronic Engineering;2023-09

3. Effects of Corner/Edge Bond and Side-fill for Automotive MCM Applications;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26

4. The Delamination Caused by Flux Residue in System-in-Package Devices;2022 36th Symposium on Microelectronics Technology (SBMICRO);2022-08-22

5. Application of multi-quality parameter design in the optimization of underfilling process – a case study of a vehicle electronic module;Soldering & Surface Mount Technology;2020-10-08

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