Testing and Evaluation of Silicon Die Strength-Reference-Cited by-同舟云学术

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Testing and Evaluation of Silicon Die Strength

Published:2007-04 Issue:2 Volume:30 Page:106-114
ISSN:1521-334X
Container-title:IEEE Transactions on Electronics Packaging Manufacturing
language:
Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Tsai Ming-Yi,Lin C. S.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://xplorestaging.ieee.org/ielx5/6104/4265760/04265772.pdf?arnumber=4265772

Cited by 28 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mechanical Modelling and Analysis of CMOS Image Sensor Package;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. Plasma dicing before grinding process for highly reliable singulation of low-profile and large die sizes in advanced packages;Micro and Nano Systems Letters;2023-11-18

3. Correction factors to biaxial bending strength of thin silicon die in the ball-on-ring test by considering geometric nonlinearity and material anisotropy;Journal of Mechanics;2023

4. Specific Packaging Reliability Testing;Springer Series in Reliability Engineering;2023

5. Study of robust package strength characterization of memory packages for handheld application;Memories - Materials, Devices, Circuits and Systems;2022-12

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