Study of robust package strength characterization of memory packages for handheld application-Reference-Cited by-同舟云学术

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Study of robust package strength characterization of memory packages for handheld application

Published:2022-12 Issue: Volume:3 Page:100018
ISSN:2773-0646
Container-title:Memories - Materials, Devices, Circuits and Systems
language:en
Short-container-title:Memories - Materials, Devices, Circuits and Systems

Author:

Liu Vance^ORCID,Chen Chien-Ming^ORCID,Chen Joyce^ORCID,Chung Min-Hua,Gan Chong Leong^ORCID

Publisher

Elsevier BV

Reference34 articles.

1. Monotonic Bend Characterization of Board-Level Interconnects;JEDEC IPC-9702,2004

2. Board Level Drop Test Method of Components for Handheld Electronic Products;JEDEC JESD22-B111A,2003

3. A study of crack propagation in Pb-free solder joints under drop impact;Caers,2008

4. Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull;Zaal;Microelectron. Reliab.,2009

5. A review of board level solder joints for mobile applications;Wong;Microelectron. Reliab.,2008

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability Simulation and Modeling in Memory Packaging;Springer Series in Reliability Engineering;2023

2. Specific Packaging Reliability Testing;Springer Series in Reliability Engineering;2023

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