A Study of Crack Propagation in Pb-Free Solder Joints-Reference-Cited by-同舟云学术

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A Study of Crack Propagation in Pb-Free Solder Joints

Published:2010-04 Issue:2 Volume:33 Page:84-90
ISSN:1521-334X
Container-title:IEEE Transactions on Electronics Packaging Manufacturing
language:
Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Caers J. F. J. M.,Zhao X. J.,Wong E. H.,Seah S. K. W.,Selvanayagam C. S.,van Driel W. D.,Owens N.,Leoni M.,Tan L. C.,Eu P. L.,Lai Yi-Shao,Yeh Chang-Lin

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://xplorestaging.ieee.org/ielx5/6104/5441188/05431041.pdf?arnumber=5431041

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Non-destructive experimental technique to determine ball contact load in rolling machine elements;Tribology International;2024-07

2. Modeling and Analysis of Signal Integrity of High-Frequency Transmission Channel With Degraded Fuzz Button Connectors;IEEE Transactions on Electromagnetic Compatibility;2024

3. Identification of Solder Joint Failure Modes Using Machine Learning;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-12

4. Twin‐Wire Sensor Networks;Advanced Sensor Research;2023-05-05

5. The Impact of the Connection Failure of Ground Solder Balls on Digital Signal Waveform;IEEE Transactions on Electromagnetic Compatibility;2023-02

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