Advanced Insulation Materials for Next Generation Packaging Technology-Reference-Cited by-同舟云学术

Advanced Insulation Materials for Next Generation Packaging Technology

Published:2022-11-09 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE CPMT Symposium Japan (ICSJ)
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Author:

Tatsumi Shiro¹

Affiliation:

1. Reserch Institute for Bioscience Products & Fine Chemical Ajinomoto Co., Inc.,Kawasaki-shi,Kanagawa Pref.,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10034668/10034662/10034663.pdf?arnumber=10034663

Reference6 articles.

1. Low-Transmission-Loss Multilayer Material, MCL-LZ-71G, for Environmentally Friendly Printed Wiring Board;shimizu;Hitachi Chemical Technical Report No 50,2008

2. A Low Dk, Df, and Highly Heat Resistant Material for Multilayer Printed Wiring Boards;kitai;Panasonic Electric Works Technical Report,0

3. Embedded Trench Redistribution Layers (RDL) by Excimer Laser Ablation and Surface Planer Processes

4. Advanced Build-up Materials for High Speed Transmission Application

5. Interlayer insulating film for printed circuit boards;mago;Journal-of-electronic-materials,2005

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4. Curing Kinetics and Mechanical Properties of Epoxy–Cyanate Ester Composite Films for Microelectronic Applications;ACS Omega;2023-08-29