Partial Underfill Impact Study on Solder Joint Reliability in Smartphone Application
Author:
Affiliation:
1. Micron Semiconductor Asia Operations Pte. Ltd,Singapore,Singapore,339942
2. Micron Technology, Inc.,Boise,ID,USA
3. Micron Memory Taiwan Co,Taichung City,TA,Taiwan,42152
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013204.pdf?arnumber=10013204
Reference7 articles.
1. Development on Fatigue Life Model of Lead-Free Solder for First Failure Prediction
2. Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods;hongbin;Microelectronic Reliability,2012
3. Predictive Solder Joint Reliability Modeling for Early Risk Assessment
4. Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints
5. Acceleration models, constitutive equations, and reliability of lead-free solders and joints
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