Mechanical properties of transient liquid phase bonded joints by using Ag-In sandwich structure
Author:
Affiliation:
1. Joining and Welding Research Institute, Osaka University,Ibaraki,Osaka,Japan,565-0047
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013239.pdf?arnumber=10013239
Reference26 articles.
1. A Review on Recent Advances in Transient Liquid Phase (TLP) Bonding for Thermoelectric Power Module
2. Overview of transient liquid phase and partial transient liquid phase bonding
3. Evolution of Transient Liquid-Phase Sintered Cu–Sn Skeleton Microstructure During Thermal Aging
4. Nickel–Tin Transient Liquid Phase Bonding Toward High-Temperature Operational Power Electronics in Electrified Vehicles
5. Rapid Ag/Sn/Ag transient liquid phase bonding for high-temperature power devices packaging by the assistance of ultrasound
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1. Transparent Liquid Ag-Based Complex for the Facile Preparation of Robust Sintered Ag Joints in Power Devices;ACS Applied Electronic Materials;2024-02-28
2. Analysis of microstructures and fractures in Ag–In transient liquid phase bonded joints;Materials Science and Engineering: A;2024-02
3. Thermomechanical Properties of Zeta (Ag3In) Phase;Materials;2023-11-10
4. Fabrication and thermo-mechanical properties of Ag9In4 intermetallic compound;Intermetallics;2023-11
5. Failure Analysis of Joints Bonded by Ag-In Transient Liquid Phase Process during Shear Test;2023 International Conference on Electronics Packaging (ICEP);2023-04-19
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