Process variations in dielectric inserted side contact multilayer graphene nanoribbon interconnects using montecarlo simulations-Reference-Cited by-同舟云学术

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Process variations in dielectric inserted side contact multilayer graphene nanoribbon interconnects using montecarlo simulations

Published:2022-12-07 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
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Author:

Kumar Mekala Girish¹,Agrawal Yash²,Kumar Vobulapuram Ramesh³

Affiliation:

1. TKR College of Engineering and Technology,Department of Electronics and Communication Engineering,Hyderabad,India

2. DA-IICT,Department of Information and Communication Technology,Gandhinagar,India

3. IIIT Sricity,Department of Electronics and Communication Engineering,Chittoor,India

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013293.pdf?arnumber=10013293

Reference17 articles.

1. Performance Improvement in SC-MLGNRs Interconnects Using Interlayer Dielectric Insertion

2. Modelling and performance analysis of dielectric inserted side contact multilayer graphene nanoribbon interconnects;kumar;IET Circuits Devices & Systems,2017

3. Transient and Crosstalk Analysis of Doped and Dielectric Inserted MLGNR Interconnects

4. Quality of Signal Improvement in Prominent CNTFET Based Ternary Logic System for Futuristic Dielectric Inserted MLGNRs for Integrated Circuit Designs

5. On the Impact of Process Variations for Carbon Nanotube Bundles for VLSI Interconnect

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Applying the high-k dielectric materials in vertical multilayer graphene nanoribbon (V-MLGNR) based interconnect for improving transmission performance;Micro and Nanostructures;2024-09

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