Funder
Economic Development Board of Singapore (EDB) and Advanced Micro Devices (AMD) Inc., through the Industry Postgraduate Program
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering,General Materials Science,General Computer Science
Cited by
3 articles.
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1. AI-assisted Design for Reliability: Review and Perspectives;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Study of wafer warpage reduction by dicing street;Japanese Journal of Applied Physics;2022-06-10
3. Global Optimization of Surface Warpage for Inverse Design of Ultra-Thin Electronic Packages Using Tensor Train Decomposition;IEEE Access;2022