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Improved Numerical-Analytical Thermal Modeling Method of the PCB With Considering Radiation Heat Transfer and Calculation of Components’ Temperature

  • Published:2021 Issue: Volume:9 Page:92925-92940
  • ISSN:2169-3536
  • Container-title:IEEE Access
  • language:
  • Short-container-title:IEEE Access

Author:

Zhang YabinORCID

Funder

Sichuan Science and Technology Program

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering,General Materials Science,General Computer Science

Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Navigating speed–accuracy trade-offs for multi-physics simulations;Meccanica;2024-08-25

2. Verification of Computer Simulation of Temperature Influence on Microstrip Line Characteristics;2024 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM);2024-05-20

3. Numerical study on thermal-electrical-mechanical coupling mechanism of electrical connectors considering contact resistance;Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science;2023-07-20

4. Experimental Study of the Temperature Field of an Electronic Module;2023 18th Conference on Electrical Machines, Drives and Power Systems (ELMA);2023-06-29

5. Automatic tool for real-time estimation of QFN-related heat transfer in multi-layer PCB by using SPICE simulations;2023 9th International Workshop on Advances in Sensors and Interfaces (IWASI);2023-06-08
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