Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering,General Materials Science,General Computer Science
Cited by
14 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Junction Temperature Optical Sensing Techniques for Power Switching Semiconductors: A Review;Micromachines;2023-08-19
3. An Improved Cauer Model of IGBT Module Considering Chip Solder Degradation;2023 IEEE 14th International Symposium on Power Electronics for Distributed Generation Systems (PEDG);2023-06-09
4. Power Module Thermal Characterization Considering Aging Towards Online State-of-Health Monitoring;2023 IEEE Applied Power Electronics Conference and Exposition (APEC);2023-03-19
5. A 3-D Thermal Network Model for Monitoring of IGBT Modules;IEEE Transactions on Electron Devices;2023-02