1. College of Information and Electronic Engineering, Innovative Institute of Electromagnetic Information and Electronic Engineering, Zhejiang University, Hangzhou, China
2. Beijing Smart-Chip Microelectronics Technology Company Ltd.1, Beijing, China
3. Science and Technology on Electromagnetic Compatibility Laboratory, Wuhan, China
4. Research and Development Laboratory, Zhejiang Zhaolong Interconnect Technology Company Ltd., Huzhou, China
5. Hangzhou Applied Acoustics Research Institute, Hangzhou, China
6. Faculty of Electrical Engineering and Computer Science, Ningbo University, Ningbo, China